GIGABYTE AMD X570 AORUS Motherboard with 12+2 Phase Digital VRM with DrMOS, Advanced Thermal Design with Enlarge Heatsink

In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem. GET READY FOR AMD RYZEN 3000-SERIES GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for 3rd Gen AMD Ryzen™ Processors. The all-new design is a testament to GIGABYTE's dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0 and USB Type-C interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users' performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen 3000-series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system. AMD StoreMI Technology GIGABYTE X570 motherboards maximize your PC's potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system. Ultimate Power Design To unleash the full potential of the 3rd Generation of AMD Ryzen CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.

GIGABYTE AMD X570 AORUS Motherboard with 12+2 Phase Digital VRM with DrMOS, Advanced Thermal Design with Enlarge Heatsink CPU: AMD Socket AM4, support for: 3rd Generation AMD Ryzen processors/ 2nd Generation AMD Ryzen processors/ 2nd Generation AMD Ryzen with Radeon Vega Graphics processors/ AMD Ryzen with Radeon Vega Graphics processors Chipset: AMD X570 Memory: 3rd Generation AMD Ryzen™ processors: Support for DDR4 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 2933 / 2667 / 2400 / 2133 MHz memory modules, 2nd Generation AMD Ryzen processors/AMD Ryzen with Radeon Vega Graphics processors: Support for DDR4 3200(O.C.) / 2933 / 2667 / 2400 / 2133 MHz memory modules, 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory, Dual channel memory architecture, Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules, Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules, Support for Extreme Memory Profile (XMP) memory modules Onboard Graphics: Integrated Graphics Processor: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz, Maximum shared memory of 16 GB Audio: Realtek ALC1200 codec, High Definition Audio, 2/4/5.1-channel, Support for S/PDIF Out LAN: Intel GbE LAN chip (10/100/1000 Mbit) Wireless Communication module: Wi-Fi 802.11 a/b/g/n/ac, supporting 2.4/5 GHz Dual-Band, BLUETOOTH 4.2, Support for 11ac wireless standard and up to 433 Mbps data rate Expansion Slots: Integrated in the CPU (PCIEX16): 3rd Generation AMD Ryzen processors: 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16, 2nd Generation AMD Ryzen processors: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16, · 2nd Generation AMD Ryzen with Radeon Vega Graphics processors/AMD Ryzen with Radeon Vega Graphics processors: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x8, Integrated in the Chipset (PCIEX4/PCIEX1): 1 x PCI Express x16 slot, supporting PCIe 4.0*/3.0 and running at x4 (PCIEX4), 2 x PCI Express x1 slots, supporting PCIe 4.0*/3.0 Multi-Graphics Technology: Support for AMD Quad-GPU CrossFire and 2-Way AMD CrossFire technologies Storage Interface: Integrated in the CPU (M2A_SOCKET): 3rd Generation AMD Ryzen processors: 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0 x4/x2 SSD support), · 2nd Generation AMD Ryzen™ processors/2nd Generation AMD Ryzen with Radeon Vega Graphics processors/AMD Ryzen with Radeon Vega Graphics processors: 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 3.0 x4/x2 SSD support), Integrated in the Chipset (M2B_SOCKET): 1 x M.2 connector (Socket 3, M key, type 2242/2260/2280/22110 SATA and PCIe 4.0*/3.0 x4/x2 SSD support), 6 x SATA 6Gb/s connectors, Support for RAID 0, RAID 1, and RAID 10 1 x USB Type-C port with USB 3.2 Gen 2 support, available through the internal USB header 1. 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel 1. 4 x USB 3.2 Gen 1 ports available through the internal USB headers Chipset+2 USB 2.0 Hubs: 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)